Ultra thin vapor chamber for high precision electronic equipment

Short Description:

The mechanism is the same as the uniform vapor chamber. The cavity material is phosphor bronze or stainless steel. And the multilayer fiber fine wick structure is as thin as 0.4mm.

The operating principle of the ultra thin vapor chamber can be classified into: i) one dimensional heat transport; ii) two dimensional heat transport, where heat rejection occurs over the entire surface opposite of the evaporator.


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Ultra thin vapor chamber

The wick structures are core components of the two-phase heat transfer devices, which provide the capillary force to drive the closed circulation of the working fluid and an interface for the liquid–vapour phase changes. The start-up and thermal performance of the heat pipes rely mainly on the wick structures.

The main difficulty of ultra-thin vapor chamber is the design of its capillary structure. Sufficient capillary structures need to be laid in a very small space to meet the rapid reflux of condensate working fluid. The capillary structure used by ultra-thin vapor chamber usually includes wire mesh structure, sintered powder structure, braided fiber, groove structure, etc.

The mesh structure has the characteristics of high porosity but low permeability, so that it has good temperature characteristics. The sintered powdery structure is characterized by high permeability but low porosity so that it has low thermal resistance. One or more capillary structures are generally used in ultra-thin vapor chamber to meet liquid reflux, but the increase of capillary structure will lead to the reduction of internal steam chamber to increase gas flow resistance, so the design of capillary structure becomes the key of ultra-thin vapor chamber.

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The packaging process is a critical step for fabricating ultra thin vapor chamber. Ineffective packaging can cause uneven temperature distribution and also working fluid leakage from ultra thin vapor chamber during the operation process. Four main bonding technologies, laser welding, diffusion bonding, eutectic bonding and thermal bonding, are used to package ultra thin vapor chamber.

Application: mobile phone, tablet PC, smartwatches, VR glasses, and other high precision electronic equipment.


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