The thermal management scheme for Data Centers
Our company's vapor chamber and water cooling plate can effectively conduct heat transfer for multiple heat source chips at the same time, and heat dissipation performance can reach 500W and the corresponding heat flux density exceeds 50W/cm2. The vapor chamber can be used for heat dissipation of the server motherboard, which has multiple high heat flux processor chips. The characteristic of the vapor chamber is that the inside of the shell is hollow to form a cavity, the inner wall of the cavity is sintered with copper powder or copper mesh to provide capillary force, and the cavity is filled with a certain proportion of working fluid. Additionally, the bottom surface of the vapor chamber is arranged with a large plane and some smaller bosses.
The large plane is used to contact sever processor chip, and some smaller bosses are applied respectively to contact other heat source chips on the server motherboard. The water cooling plate is processed in the metal plate to form the flow channel, and the common types of flow channels include serpentine, parallel, pin-type to increase the heat dissipation area and decrease the pressure drop loss. The server motherboard is installed on the surface of the water cooling plate (the middle is coated with a heat-conducting medium), and the cooling liquid enters from the inlet and exits from the outlet of the water cooling plate to take away the heat from the components. In this way, the server can meet the heat dissipation standards and keep the server at an acceptable temperature.