Cooling Product

  • The thermal management scheme for Data Centers

    The thermal management scheme for Data Centers

    Data Centers (DCs) are computing structures housing a large number of Information and Communications Technology (ICT) devices installed for processing, storing and transmitting information. Due to the narrow operating space and high heat flux density, efficient cooling of server chips in DCs has become a worldwide problem. For 1U servers or blade servers, liquid cooling has become an efficient and commonly used cooling technology. And 2U servers with relatively larger operating space can apply vapor chamber cooling technology. However, the traditional vapor chamber can only contact 1-2 heat sources, which will cause the temperature of some chips to be too high, and the heat dissipation performance cannot meet the requirements.

  • The thermal management scheme for 5G base station

    The thermal management scheme for 5G base station

    With the rapid development of 5G technologies, the miniaturization and precision of electronic products, and the increasing amount of communication data and communication speed, the total power and computing capabilities of base stations have greatly increased. At present, the power consumption of 5G base station is 2.5 to 3.5 times that of 4G, and the maximum heat flux density of high-end CPUs can reach 75W/cm2, which is mainly generated during signal conversion, processing and transmission by AAU and BBU. Additionally, the communication base stations are usually installed in poor locations, such as plateaus, deserts, forest. Therefore, the stable operation of 5G base station is crucial under high heat flux density and poor conditions.

  • Water cooling plate and Vacuum brazing water cold plate

    Water cooling plate and Vacuum brazing water cold plate

    Product/Service level, Uniqueness

    All products are non-standard customization. Our company is one of the production companies integrating R&D, design, production and sales. We are supported by many other domestic research and development teams. The key team is based on South China University of Technology for thermal design, CFD simulation and feasibility study.

  • Multi-application customized VC Module Radiator

    Multi-application customized VC Module Radiator

    Mainly used in: computer graphics cards, computer chips, servers, 5G base stations, laser heat dissipation, military and subdivided fields of electronic products market.

  • Ultra thin vapor chamber for high precision electronic equipment

    Ultra thin vapor chamber for high precision electronic equipment

    The mechanism is the same as the uniform vapor chamber. The cavity material is phosphor bronze or stainless steel. And the multilayer fiber fine wick structure is as thin as 0.4mm.

    The operating principle of the ultra thin vapor chamber can be classified into: i) one dimensional heat transport; ii) two dimensional heat transport, where heat rejection occurs over the entire surface opposite of the evaporator.

  • Pulsating heat pipe

    Pulsating heat pipe

    Pulsating heat pipes are mostly made of copper tube or aluminum plate. Pulsating flat heat pipe has been widely used because of its adaptability to various applications. Pulsating heat pipes can be divided into closed loop pulsating heat pipes, open loop pulsating heat pipes and pulsating heat pipes with valves. The open-loop pulsating heat pipe has better start-up performance than the closed-loop pulsating heat pipe, but its thermal resistance is higher than that of the closed-loop pulsating heat pipe.

  • Conventional vapor chamber for electronic products

    Conventional vapor chamber for electronic products

    Material: usually made of copper

    Structure: a vacuum cavity with a wick microstructure on the inner wall

    Application: server, high-grade graphics card, 5G base station, aerospace, rail transportation, power grid, laser heat dissipation, military, and subdivided fields of electronic products market products, etc.

  • Battery thermal management system for new energy vehicles

    Battery thermal management system for new energy vehicles

    According to technology provided by our company, the heat generated during the operation of the lithium battery cell is transmitted to the pulsating heat pipe through the thermal conductive silicon film, and the heat is taken away by the free circulating flow of the thermal expansion and contraction of the coolant, so as to reduce the temperature of the cell, make the whole battery pack operate within the safe temperature range, eliminate the risk of thermal runaway and improve the safety performance. In addition, the pulsating heat pipe used in our design has strong temperature uniformity, which can ensure the temperature uniformity between battery cells and effectively alleviate the consistency of battery packs, thereby prolong the service life of lithium batteries and the mileage of NEV.

  • Cooling and cooling system of  medical equipment

    Cooling and cooling system of medical equipment

    Fastrun Thermal Technology CO., LTD (FTT) has been committed to participate in the research and development of medical equipment heat dissipation system design, to help various medical technology companies to solve the problem of product heat dissipation. We can customize all kinds of cooling devices and design schemes according to your specific needs. Our company will according to the different products, put forward a variety of economical and reliable solutions for you to choose, to ensure that your company’s medical equipment can work in the appropriate temperature range, so as to effectively protect medical equipment components, and improve the efficiency of medical equipment.

  • The application of vapor chamber in mobile phone

    The application of vapor chamber in mobile phone

    With the rapid development of microelectronics technology, the power consumption of electronic components is increasing and the structure volume is shrinking. The high heat flux generated by electronic components in a narrow space can not be dissipated in time, resulting in the temperature exceeding the upper limit of the operating temperature of electronic components, which seriously affects the performance and life of electronic equipment.